Wednesday, January 27, 2010

Field-effect transistor

The field-effect transistor (FET) relies on an electric field to control the shape and hence the conductivity of a channel of one type of charge carrier in a semiconductor material. FETs are sometimes called unipolar transistors to contrast their single-carrier-type operation with the dual-carrier-type operation of bipolar (junction) transistors (BJT). The concept of the FET predates the BJT, though it was not physically implemented until after BJTs due to the limitations of semiconductor materials and the relative ease of manufacturing BJTs compared to FETs at the time.

High-power N-channel field-effect transistor

Terminals

All FETs have a gate, drain, and source terminal that correspond roughly to the base, collector, and emitter of BJTs. Aside from the JFET, all FETs also have a fourth terminal called the body, base, bulk, or substrate. This fourth terminal serves to bias the transistor into operation; it is rare to make non-trivial use of the body terminal in circuit designs, but its presence is important when setting up the physical layout of an integrated circuit.

Cross section of an n-type MOSFET

The names of the terminals refer to their functions. The gate terminal may be thought of as controlling the opening and closing of a physical gate. This gate permits electrons to flow through or blocks their passage by creating or eliminating a channel between the source and drain. Electrons flow from the source terminal towards the drain terminal if influenced by an applied voltage. The body simply refers to the bulk of the semiconductor in which the gate, source and drain lie. Usually the body terminal is connected to the highest or lowest voltage within the circuit, depending on type. The body terminal and the source terminal are sometimes connected together since the source is also sometimes connected to the highest or lowest voltage within the circuit, however there are several uses of FETs which do not have such a configuration, such as transmission gates and cascode circuits.

Types of field-effect transistors

Depletion-type FETs under typical voltages. JFET, poly-silicon MOSFET, double-gate MOSFET, metal-gate MOSFET, MESFET. depletion , electrons , holes , metal , insulator . Top=source, bottom=drain, left=gate, right=bulk. Voltages that lead to channel formation are not shown

The channel of a FET (explained below) is doped to produce either an N-type semiconductor or a P-type semiconductor. The drain and source may be doped of opposite type to the channel, in the case of depletion mode FETs, or doped of similar type to the channel as in enhancement mode FETs. Field-effect transistors are also distinguished by the method of insulation between channel and gate. Types of FETs are:

  • The MOSFET (Metal–Oxide–Semiconductor Field-Effect Transistor) utilizes an insulator (typically SiO) between the gate and the body.
  • The DGMOSFET is a MOSFET with dual gates.
  • The JFET (Junction Field-Effect Transistor) uses a reverse biased p-n junction to separate the gate from the body.
  • The MESFET (Metal–Semiconductor Field-Effect Transistor) substitutes the p-n junction of the JFET with a Schottky barrier; used in GaAs and other III-V semiconductor materials.
  • Using band gap engineering in a ternary semiconductor like AlGaAs gives a HEMT (High Electron Mobility Transistor), also called an HFET (heterostructure FET). The fully depleted wide-band-gap material forms the isolation between gate and body.
  • The MOSFET (Modulation-Doped Field Effect Transistor) uses a quantum well structure formed by graded doping of the active region.
  • The IGBT (Insulated-Gate Bipolar Transistor) is a device for power control. It has a structure akin to a MOSFET coupled with a bipolar-like main conduction channel. These are commonly used for the 200-3000 V drain-to-source voltage range of operation. Power MOSFETs are still the device of choice for drain-to-source voltages of 1 to 200 V.
  • The FREDFET (Fast Reverse or Fast Recovery Epitaxial Diode FET) is a specialized FET designed to provide a very fast recovery (turn-off) of the body diode.
  • The ISFET is an Ion-Sensitive Field Effect Transistor used to measure ion concentrations in a solution; when the ion concentration (such as pH) changes, the current through the transistor will change accordingly.
  • The DNAFET is a specialized FET that acts as a biosensor, by using a gate made of single-strand DNA molecules to detect matching DNA strands.
  • Composition

    The FET can be constructed from a number of semiconductors, silicon being by far the most common. Most FETs are made with conventional bulk semiconductor processing techniques, using the singal crystal semiconductor wafer as the active region, or channel.

    Among the more unusual body materials are amorphous silicon, polycrystalline silicon or other amorphous semiconductors in thin-film transistor or organic field effect transistor that are based on organic semiconductor and often apply organic gate insulators and electrodes.

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